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Product：16 layer control motherboard
Layer size 16L
Plate thickness 4.0mm
Outer copper thickness: 1 oz
Inner copper thickness: 1 oz
Minimum aperture 0.50mm
Minimum line width/spacing: 6mil
Surface treatment: immersion gold
Product use: Control motherboard
Process difficulty: 22 impedance groups
Plate thickness 4.0mm
Outer copper thickness: 1 oz
Inner copper thickness: 1 oz
Minimum aperture 0.50mm
Minimum line width/spacing: 6mil
Surface treatment: immersion gold
Product use: Control motherboard
Process difficulty: 22 impedance groups
