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Product：26 layer gold-plated board
Layer 26L
Plate thickness 6.6mm
Outer copper thickness: 2 OZ
Inner copper thickness: 2 OZ
Minimum aperture 0.8mm
Minimum line width/spacing: 3mil
Surface treatment: immersion gold
Product Usage: IC testing instrument
Process difficulty: High multi-layer board
Plate thickness 6.6mm
Outer copper thickness: 2 OZ
Inner copper thickness: 2 OZ
Minimum aperture 0.8mm
Minimum line width/spacing: 3mil
Surface treatment: immersion gold
Product Usage: IC testing instrument
Process difficulty: High multi-layer board
