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Product：12 layer high-frequency board
Layer size 12L
Plate thickness 2.0mm
Outer copper thickness: 1 OZ
Inner copper thickness: 1 OZ
Minimum aperture 0.25mm
Minimum line width/spacing: 4mil
Surface treatment and gold deposition
Product use: Micro base station
Process difficulty: High and multi-layer
Plate thickness 2.0mm
Outer copper thickness: 1 OZ
Inner copper thickness: 1 OZ
Minimum aperture 0.25mm
Minimum line width/spacing: 4mil
Surface treatment and gold deposition
Product use: Micro base station
Process difficulty: High and multi-layer
Next：14th floor
